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 INTEGRATED CIRCUITS
DATA SHEET
TEA5591 AM/FM radio receiver circuit
Product specification File under Integrated Circuits, IC01 June 1989
Philips Semiconductors
Product specification
AM/FM radio receiver circuit
GENERAL DESCRIPTION
TEA5591
The TEA5591 is an integrated radio circuit which is designed for use in portable receivers and clock radios. The IC is also applicable to mains-fed AM an AM/FM receivers and car radio-receivers. The main advantage of this IC is its ability to operate over a wide range of supply voltages without loss of performance. The AM circuit incorporates a balanced mixer and a `one-pin' oscillator, which operates in the 0.6 MHz to 30 MHz frequency range, with amplitude control. The circuit also includes an IF amplifier, a detector and an AGC circuit which controls the IF amplifier and the mixer. The FM circuit incorporates an RF amplifier, a balanced mixer and a `one-pin' oscillator together with two AC coupled IF amplifiers (with distributed selectivity), a quadrature demodulator for the ceramic filter and internal AFC. Features * DC AM/FM switch facility * Three internal separate stabilizers to enable operation over a wide range of supply voltages (1.8 to 15 V) * All pins (except pin 9) are ESD protected. QUICK REFERENCE DATA PARAMETER Supply voltage (pin 8) Supply current AM part FM part Operating ambient temperature range AM performance (pin 13) RF sensitivity RF input voltage RF input voltage Signal plus noise-to-noise ratio AF output voltage Total harmonic distortion FM performance (pin 1) RF sensitivity RF input voltage -3 dB before limiting Signal plus noise-to-noise ratio for: RF input signal voltage (Vi) AF output voltage Total harmonic distortion PACKAGE OUTLINE 20-lead DIL; plastic (SOT146); SOT146-1; 1996 August 14. Vi = 3.0 V Vi = 1 mV Vi = 100 V (S+N)/N (S+N)/N Vo THD 23 - 75 - 26 60 90 0.8 - - - - dB dB mV % Vi - 2.3 4.0 V f = 22.5 kHz Vo = 10 mV (S+N)/N = 26 dB Vi = 1 mV Vi Vi (S+N)/N Vo THD - - - - - 3.5 17 48 50 0.7 - - - - - V V dB mV % m = 0.3 IP(AM) IP(FM) Tamb - - -15 14 17 - 19 23 +60 mA mA C CONDITIONS SYMBOL VP MIN. 1.8 TYP. 3.0 MAX. 15 V UNIT
June 1989
2
Philips Semiconductors
Product specification
AM/FM radio receiver circuit
TEA5591
June 1989
3
Fig.1 Block diagram.
Philips Semiconductors
Product specification
AM/FM radio receiver circuit
TEA5591
June 1989
4
Fig.2 Equivalent circuit diagram.
Philips Semiconductors
Product specification
AM/FM radio receiver circuit
PINNING
TEA5591
Fig.3 Pinning diagram.
June 1989
5
Philips Semiconductors
Product specification
AM/FM radio receiver circuit
RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) PARAMETER Supply voltage (pin 8) Storage temperature range Operating ambient temperature range Total power dissipation CONDITIONS SYMBOL VP Tstg Tamb Ptot - -65 -15 MIN.
TEA5591
MAX. 18 + 150 + 60 V
UNIT C C
see Fig.4
Fig.4 Power derating curve.
June 1989
6
Philips Semiconductors
Product specification
AM/FM radio receiver circuit
TEA5591
DC CHARACTERISTICS All voltages are referenced to pin 3; all input currents are positive; all parameters are measured in Fig.5 at nominal supply voltage VP = 3 V; Tamb = 25 C unless otherwise specified PARAMETER Supply voltage Voltages (FM) pin 1 pin 2 pin 4 pin 5 pin 6 pin 9 pin 14 pin 17 pin 19 Voltages (AM) pin 2 pin 12 pin 15 Supply current AM part FM part IP(AM) IP(FM) - - 14 17 19 23 mA mA V2 V12 V15 - - - 1.10 1.60 1.54 - - - V V V V1 V2 V4 V5 V6 V9 V14 V17 V19 - - - 1.5 - - - - - 0.90 1.60 0.85 1.60 1.48 1.05 1.63 0.60 1.60 - - - 1.75 - - - - - V V V V V V V V V CONDITIONS SYMBOL VP 1.8 MIN. TYP. 3.0 MAX. 15 V UNIT
June 1989
7
Philips Semiconductors
Product specification
AM/FM radio receiver circuit
AC CHARACTERISTICS VP = 3 V; Tamb = 25 C unless otherwise specified PARAMETER AM PART Input conductance pin 4 Input capacitance pin 4 Input conductance pin 13 Input capacitance pin 13 Output conductance pin 7 Output capacitance pin 7 Conductance pin 11 Capacitance pin 11 FM PART Input conductance pin 4 Input capacitance pin 4 Input conductance pin 14 Input capacitance pin 14 Output conductance pin 6 Output capacitance pin 6 Output conductance pin 16 Output capacitance pin 16 Conductance pin 9 Capacitance pin 9 Conductance pin 18 Capacitance pin 18 f = 10.7 MHz f = 10.7 MHz f = 10.7 MHz f = 10.7 MHz f = 10.7 MHz f = 10.7 MHz f = 10.7 MHz f = 10.7 MHz f = 10.7 MHz f = 10.7 MHz f = 100 MHz f = 100 MHz gie Cie gie Cie goe Coe goe Coe ge Ce ge Ce - - - - - - - - - - - - 2.7 6 2.8 2.5 2.8 3.0 1.6 4.5 880 3.6 -4 10 - - - - - - - - - - - - f = 0.5 MHz f = 0.5 MHz f = 1.0 MHz f = 1.0 MHz f = 0.5 MHz f = 0.5 MHz f = 1.5 MHz f = 1.5 MHz gie Cie gie Cie goe Coe ge Ce - - - - - - - - 1.7 5 230 13 4 4.7 -6.8 25 - - - - - - - - CONDITIONS SYMBOL MIN. TYP.
TEA5591
MAX.
UNIT
ms pF s pF s pF ms pF
ms pF ms pF ms pF s pF s pF ms pF
June 1989
8
Philips Semiconductors
Product specification
AM/FM radio receiver circuit
TEA5591
AC CHARACTERISTICS All parameters are measured in Fig.5 at nominal supply voltage VP = 3 V; Tamb = 25 C unless otherwise specified. RF conditions: Input frequency 1 MHz; 30% modulation where fmod = 1 kHz; unless otherwise specified PARAMETER AM PERFORMANCE RF sensitivity AF output voltage for: Vi = 7.5 V Noise Signal plus noise-to-noise ratio for: RF input signal voltage of Vi = 17 V Vi = 1 mV Optimum source impedance Noise factor AGC Change in RF input voltage for 10 dB change in output voltage AF output voltage Total harmonic distortion Vi1 = 100 mV Vi = 100 V Vi = 100 V to 10 mV Vi = 100 V to 10 mV; m = 0.8 Vi = 80 mV; m = 0.8 THD THD - - 3 - 5 8 % % Vi1/Vi2 Vo THD 80 40 - 86 50 0.7 - 60 1.5 dB mV % optimum noise impedance (S + N)/N (S + N)/N ZS NF 23 - - - 26 48 1.8 4 - - - - dB dB k dB no AGC Vo 16 30 40 mV CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
June 1989
9
Philips Semiconductors
Product specification
AM/FM radio receiver circuit
TEA5591
PARAMETER IF suppression (note 1) Oscillator (pin 11) Input voltage
CONDITIONS
SYMBOL - - -
MIN.
TYP. -
MAX.
UNIT
Vo = 30 mV fosc = 1.5 MHz fosc = 30.5 MHz VP = 1.5 V
20
dB
Vosc Vosc Vosc
150 150 -
190 - -
mV mV mV
100
Temperature behaviour Sensitivity Output voltage Oscillator frequency LW MW SW Supply voltage behaviour Sensitivity Output voltage Oscillator frequency LW MW SW
-15 to + 60 C (only the IC) Vi Vi = 1 mV Vo fosc fosc fosc VP = 1.8 to 15 V Vi Vi = 1 mV Vo fosc fosc fosc - - - - - 0 0.5 6 0.1 30 - - - - - dB dB kHz kHz kHz - - - - - -2 1 500 300 100 - - - - - dB dB Hz Hz kHz
Transimpedance (Ztr) = V4/i7 = 900.
June 1989
10
Philips Semiconductors
Product specification
AM/FM radio receiver circuit
TEA5591
AC CHARACTERISTICS All parameters are measured in Fig.5 at nominal supply voltage VP = 3 V; Tamb = 25 C unless otherwise specified RF conditions: Input frequency 100 MHz; frequency deviation f = 22,5 kHz and fmod = 1 kHz PARAMETER FM PERFORMANCE RF sensitivity RF input voltage Noise Signal plus noise-to-noise ratio for: RF input signal voltage (Vi) Vi = 3.0 V Vi = 1 mV Optimum source impedance Noise factor AF output voltage Total harmonic distortion Vi = 30 V to 50 mV Vi = 1 mV; f = 75 kHz Vi = 100 mV; f = 75 kHz AM suppression RF input signal Oscillator voltage (pin 18) IF rejection ratio AFC fosc = 111.2 MHz V17 = 1.4 V V17 = 0.2 V f f - - -620 +420 - - kHz kHz note 2 Vi = 100 V to 10 mV fosc = 100 MHz VP = 1.5 V AMS Vosc Vosc IFrr - - 100 - 50 220 - 60 - - - - dB mV mV dB THD - 3 - % THD - 3 - % THD - 0.8 - % optimum noise impedance Vi = 100 V NF Vo - 75 6 90 - - dB mV (S + N)/N (S + N)/N Zsource 23 - - 26 60 50 - - - dB dB -3 dB before limiting ViFM - 2.3 4.0 V CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
June 1989
11
Philips Semiconductors
Product specification
AM/FM radio receiver circuit
TEA5591
PARAMETER Temperature behaviour RF sensitivity Output voltage Oscillator frequency Supply voltage behaviour RF sensitivity Output voltage Oscillator frequency Oscillator voltage Notes to the AC characteristics 1. V i at f i = 455 kHz = --------------------------------------------- . V i at f i = 1 MHz
CONDITIONS -15 to + 60 C (only the IC) -3 dB limiting Vi = 100 V
SYMBOL
MIN.
TYP.
MAX.
UNIT
Vi Vo fosc
- - -
-6 -2 -0.3
- - -
dB dB %
VP = 1.8 to 15 V -3 dB limiting Vi = 100 V Vi Vo fosc Vosc - - - - 6 0.5 100 1.0 - - - - dB dB kHz dB
2. AM suppression is measured at: fmod = 400 Hz, m = 0.3 for AM; fmod = 1 kHz, f = 75 kHz for FM.
June 1989
12
Philips Semiconductors
Product specification
AM/FM radio receiver circuit
TEA5591
June 1989
13
Fig.5 Test circuit.
Philips Semiconductors
Product specification
AM/FM radio receiver circuit
APPLICATION INFORMATION
TEA5591
June 1989
14
Fig.6 Application diagram.
Philips Semiconductors
Product specification
AM/FM radio receiver circuit
Component data
TEA5591
N1 L Wire diameter
= = = =
4.5 0.12 H 0.8 mm diameter 4.5 mm
Fig.7 FM BFP coil (L1).
N1 = 132 N2 = 14 N3 =9 C = 180 pF (internal) Lprim = 660 H fo = 468 kHz Wire = 0.07 mm diameter Coil type 7P-TOKO Material 7MCS
Fig.8 AM IF coil (L2). TOKO sample no. 7MCS-7P.
N1 N2 Lprim Wire
= = = =
86 11 270 H 0.07 mm diameter
Coil type 7P-TOKO Material 7BRS
Fig.9 Oscillator coil (L3). TOKO sample no. 7BRS-7P.
June 1989
15
Philips Semiconductors
Product specification
AM/FM radio receiver circuit
TEA5591
N1 N2 C fo
= = = =
11 2 85 pF (internal) 10.7 MHz
Fig.10 FM IF coil (L5). TOKO equivalent no. 119ACS-30120M.
N1 L
= 1.5 = 0.03 H
Fig.11 Oscillator coil (L6). TOKO equivalent no. 301 SN-0100.
N1 L
= 2.5 = 0.05 H
Fig.12 FM RF coil (L7). TOKO equivalent no. 301 SN-0200.
June 1989
16
Philips Semiconductors
Product specification
AM/FM radio receiver circuit
FERROCEPTOR COIL L4: N1 = 105; N2 = 10; L = 625 H CERAMIC FILTERS AM IF (K1). SFZ468 HL. FM IF (K2). SFE10 . 7 MS2. FM detector (K3). CDA10 . 7 MC1. TUNING CAPACITORS AM 140/82 pF FM 2 x 20 pF
TEA5591
June 1989
17
Philips Semiconductors
Product specification
AM/FM radio receiver circuit
TEA5591
Physical dimensions of the printed circuit board = 5.0 x 8.1 cm.
Fig.13 Printed-circuit board component side, showing component layout. For circuit diagram see Fig.6.
Fig.14 Printed-circuit board showing track side.
June 1989
18
Philips Semiconductors
Product specification
AM/FM radio receiver circuit
TEA5591
Fig.15 AM signal levels.
June 1989
19
Fig.16 FM signal levels.
Philips Semiconductors
Product specification
AM/FM radio receiver circuit
TEA5591
Fig.17 Signal and noise (VoAF), noise (VoN); reference level 0 dB = 100 mV, and total harmonic distortion (THD) as a function of input voltage (Vi) at pin 13. Measured in test circuit Fig.5. AM AGC is measured at fi = MHz; fmod = 1 kHz; m = 0.3. AM distortion is measured at fi = 1 MHz; fmod = 1 kHz.
Fig.18 Signal and noise (VoAF), noise (VoN); reference level 0 dB = 100 mV; AM suppression (AMS) and total harmonic distortion (THD) as a function of input voltage (V) at pin 1. Measured in test circuit Fig.5 at fi = 98 MHz; fmod = 1 kHz; f 22.5 kHz. AM suppression is measured at fmod = 400 Hz, m= 0.3 for AM; fmod = 1 kHz, f = 75 kHz for FM.
June 1989
20
Philips Semiconductors
Product specification
AM/FM radio receiver circuit
PACKAGE OUTLINE DIP20: plastic dual in-line package; 20 leads (300 mil)
TEA5591
SOT146-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 20 11 MH wM (e 1)
pin 1 index E
1
10
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.30 0.068 0.051 b1 0.53 0.38 0.021 0.015 c 0.36 0.23 0.014 0.009 D
(1)
E
(1)
e 2.54 0.10
e1 7.62 0.30
L 3.60 3.05 0.14 0.12
ME 8.25 7.80 0.32 0.31
MH 10.0 8.3 0.39 0.33
w 0.254 0.01
Z (1) max. 2.0 0.078
26.92 26.54 1.060 1.045
6.40 6.22 0.25 0.24
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT146-1 REFERENCES IEC JEDEC EIAJ SC603 EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-05-24
June 1989
21
Philips Semiconductors
Product specification
AM/FM radio receiver circuit
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TEA5591
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
June 1989
22


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